Apparatus for applying organic material to semiconductor wafer in which the nozzle opening adjusts in response to data
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United States of America Patent
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Feb 6, 1996
Grant Date -
N/A
app pub date -
Jan 25, 1994
filing date -
Jan 28, 1993
priority date (Note) -
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status (Latency Note)
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Abstract
An organic material applying apparatus of the present invention includes a movable organic material discharge nozzle having an organic material discharge port for discharging an organic material at a position facing a semiconductor wafer. The opening width of the discharge port is adjustable. A movement time of the nozzle measured from a predetermined position of the semiconductor wafer at a predetermined velocity of relative movements of the nozzle and semiconductor wafer is detected by a movement time detecting device. A width of that portion of the semiconductor wafer, which the discharge port of the moved nozzle faces, is calculated by a wafer width calculating device on the basis of the movement time of the nozzle detected by the movement time detecting device. The opening width of the discharge port of the nozzle is adjusted by a nozzle discharge port opening width adjusting device in accordance with the wafer width calculated by the wafer width calculating device. Thereby, the amount of wasted organic material discharged from the nozzle is reduced.
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