Freeze resistant die-attach compositions
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United States of America Patent
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Feb 6, 1996
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N/A
app pub date -
Feb 26, 1993
filing date -
Feb 26, 1993
priority date (Note) -
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Abstract
In accordance with the present invention, there is provided a novel composition for attaching a semiconductor device to a substrate. The invention composition comprises liquid monomer vehicle comprising at least two monomers wherein at least one monomer is a polycyanate ester monomer, electrically conductive filler, and a curing catalyst. Compositions of the invention remain homogeneous at room temperature for at least eight hours.
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