Method of mounting an electronic part with bumps on a circuit board
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United States of America Patent
Stats
-
Feb 6, 1996
Issued Date -
N/A
app pub date -
Jun 1, 1995
filing date -
Mar 11, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of mounting an electronic part with bumps on a circuit board is disclosed which enables bumps to be bonded to electrodes of the circuit board with certainty and which enables the judgement of the quality of bonding with precision. By making an area of the electrodes of the circuit board larger than those of the electrodes of the electronic part, the bumps heated and molten in the reflow soldering are spread over the electrodes of the circuit board to make its vertical cross-sectional configuration in a trapezoidal form. Therefore, the height dispersion of the bumps and the curvature of the circuit board are effectively absorbed whereby all the bumps can be bonded to the electrodes of the circuit board. Further, by measuring the planar area of the bumps, the judgement of the quality of bonding can be made with precision.
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