Heating units for use in semiconductor-producing apparatuses and production thereof
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United States of America Patent
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Feb 6, 1996
Issued Date -
N/A
app pub date -
Mar 23, 1993
filing date -
Mar 12, 1990
priority date (Note) -
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Abstract
A wafer heater for use in a semiconductor producing apparatus or the like. The heater includes a discoidal substrate made of a dense ceramic, and a resistance heating element buried in the substrate. The surface of the substrate other than that surface upon which a wafer is to be placed for heating is a flat surface. The heating unit further includes a hollow sheath of which inner pressure is not substantially varied even when the pressure inside the chamber changes and is partially embedded and joined to the heater, and a thermocouple inserted into the hollow sheath.
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