Method of manufacturing a memory card package
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United States of America Patent
Stats
-
Feb 13, 1996
Issued Date -
N/A
app pub date -
Dec 1, 1994
filing date -
Jul 15, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A process by which a package for a memory card is manufactured. The package comprises chiefly two stamped steel covers, (an upper and a lower cover half), each secured to a plastic frame element. The cover halves are secured by extended fingers which wrap around the plastic frame. This provides a double layer of metal at the perimeter of the frame. The two cover halves are situated so as to encapsulate the subject PCB and to affix it in its proper position. The two cover halves are then welded together using sonic welding on the plastic frame. The package has been designed to meet all PCMCIA standards, including polarizing keys and grounding points.
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Cited Art Landscape
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