Circularly symmetric sputtering apparatus with hollow-cathode plasma devices
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 13, 1996
Issued Date -
N/A
app pub date -
Mar 6, 1995
filing date -
Mar 9, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A sputtering apparatus for depositing thin films on substrates is disclosed, which includes a process chamber having a central sputtering region and an annular plasma distribution region surrounding and open to the central sputtering region, a planar disk diode positioned in the central sputtering region of the process chamber, a mechanism for positioning a substrate within the central sputtering region adjacent to the planar disk diode, and a plasma generation means for supplying plasma to the annular plasma distribution region of the process chamber for diffusion into the central sputtering region.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully