High utilization sputtering target for cathode assembly

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United States of America Patent

PATENT NO 5490914
SERIAL NO

08388205

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A sputtering target comprises a disc machined from a first piece of target grade material, having a front sputtering face and a rear face opposite. The sputtering face and target material erode during use to define a final sputtered face contour and a residual target thickness t measured from the rear face. A hub is machined from a second piece of material and is secured to the rear face of the disc. The securement device utilizes a depth of target material measured from the rear face which minimizes the thickness t in a region adjacent the hub so as to maximize the amount of the target grade material sputterable before in the region before encountering the securement device. In another form, the disc and hub are forged from a single starting slug of target grade material. The slug has an initial height to diameter ratio such that the flow lines developed in displaced target material during forging which turn upward from the disc into the hub are located at a depth of the target material measured from the rear face which also minimizes the thickness t so as to maximize the amount of the target grade material sputterable.

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Patent Owner(s)

Patent OwnerAddress
PRAXAIR S T TECHNOLOGY INC441 SACKETT POINT ROAD NORTH HAVEN CT 06473

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hurwitt, Steven Park Ridge, NJ 24 435
Weiss, Corey Monsey, NY 1 11

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