Surface mount interposer
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United States of America Patent
Stats
-
Feb 13, 1996
Grant Date -
N/A
app pub date -
Mar 21, 1994
filing date -
Mar 21, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An interposer (100) for connecting two or more printed circuit boards (302, 304) is a circuit-carrying substrate (102) with two or more solder pads (104, 109)on each of two sides (105, 107). Each of the solder pads are connected to an electrically conductive via (106) in the substrate, providing electrical interconnection from one side to the other side. Each solder pad has a solder bump (108) on it. A circuit assembly is made by soldering the solder bumps on one side of the interposer to corresponding solder pads on a printed circuit board (302). The solder bumps on the other side of the interposer are likewise soldered to the corresponding solder pads of a second printed circuit board (304).
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