Adaptable wafer probe assembly for testing ICs with different power/ground bond pad configurations
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United States of America Patent
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-
Feb 13, 1996
Grant Date -
N/A
app pub date -
Jun 30, 1994
filing date -
Jun 30, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An adaptable probe card assembly for testing an IC die includes a probe card and a decoupling apparatus selectably mounted on the probe card. A different decoupling apparatus is used for each IC die to be tested having a different power and ground bond pad configuration. Each decoupling apparatus includes a conductive ground bus connected to ground, a nonconductive support structure, and a plurality of chip capacitors sandwiched between the conductive ground bus and nonconductive support structure in such positions that they are each connected at one end to the ground bus and at another end to one of the power or ground bond pads of the IC die being tested via a conductive contact extending through a hole in the nonconductive support structure down to a signal contact formed on the probe card, which signal contact is in turn, connected to a needle making touch contact with the appropriate power or ground bond pad of the IC die being tested.
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