Three-dimensional modular assembly of integrated circuits
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United States of America Patent
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-
Feb 13, 1996
Grant Date -
N/A
app pub date -
Feb 21, 1995
filing date -
Feb 21, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit package that includes three base substrate support members. One base substrate support member is rigid and has two sides and the other two base substrate members are flexible and are located adjacent each side of the rigid base substrate support member. Each flexible base substrate support member has an inner surface and a series of flip chips are located between the inner surfaces of the flexible base substrate support members and the sides of the rigid base substrate support member. The three base substrate support members are electrically connected together and a termination connection is provided at one end of the assembly. In addition, logic chips are provided that are located adjacent the connector for controlling the various flip chips.
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