Process for applying structured layers using laser transfer
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United States of America Patent
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Feb 20, 1996
Grant Date -
N/A
app pub date -
Aug 26, 1993
filing date -
Sep 3, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In order to provide a process for applying structured layers of a functional structure of a semiconductor component, with which structured layers of a functional structure of a semiconductor component can be produced as simply as possible and with as little susceptibility as possible with respect to the quality of the semiconductor components, it is suggested that a material film be arranged above a surface region of a process substrate to be provided with the structured layer, that the material film be acted upon on its side remote from the process substrate by a focus of a laser beam located in a defined position corresponding to the structured layer to be produced and that with the laser beam in the region of the focus the material from the material film migrate to the surface region.
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