Thin substrate micro-via interconnect
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United States of America Patent
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Feb 20, 1996
Grant Date -
N/A
app pub date -
May 10, 1994
filing date -
May 10, 1994
priority date (Note) -
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Abstract
A method for forming conductive via interconnects utilizes the steps of: applying a sacrificial coating to at least one surface of a substrate; laser drilling the substrate through the sacrificial coating to form a via through-hole; applying a conductive coating to the via through-hole; and removing the sacrificial coating(s). Recasting and shattering thus occur in the sacrificial coating rather than in the substrate during the step of laser drilling so as to enhance via through-hole geometry.
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