Importance

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Abstract

A wire bonder for electrically coupling an integrated circuit die to associated wiring traces is disclosed. In one aspect of the invention, the wire bonder includes a pair of ultrasonic transducers. A capillary holder is connected between the transducers to support a capillary having a bonding wire suitable for electrically connecting an integrated circuit die pad to a lead on an associate wiring trace. A signal generator applies drive signals to the transducers to mechanically bond a bonding wire to at least one of an integrated circuit die pad and a wiring trace. The signal generator is arranged to permit independent actuation of the transducers at frequencies suitable for ultrasonic welding. The signal generator means includes a controller for controlling the timing of the drive signals. With this arrangement, the direction of ultrasonic energy applied during welding may be varied by adjusting the relative timing of actuation of the transducers. In a preferred embodiment, the controller is arranged to adjust the phase of the drive signals supplied to the transducers. In a method aspect of the invention, one end of a bonding wire is ultrasonically bonded to an IC die pad. The other end of the bonding wire is then ultrasonically bonded to the lead of an associated wiring trace. The direction of the ultrasonic energy used for bonding at least one of the ends of the bonding wires is arranged to be non-linear.

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First Claim