Method for cleaning semiconductor wafers using liquified gases
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United States of America Patent
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Feb 27, 1996
Issued Date -
N/A
app pub date -
May 4, 1995
filing date -
Apr 8, 1994
priority date (Note) -
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Abstract
A semiconductor processing system (10) is provided that comprises a cleaning chamber (12) and a load lock wafer handler chamber (14). A cleaning agent (34) is placed in a cleaning bath chamber (28). A semiconductor substrate (16) is placed in contact with the cleaning agent (34). Cleaning agent (34) is initially in a liquid phase and is caused to change to a vapor phase so that the cleaning agent (34) can penetrate the topography of the surface to be cleaned. Cleaning agent (34) is then returned to a liquid phase and finally flash-evaporated to complete the cleaning process.
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