Teflon filled resinoid dicing blades for fabricating silicon die modules
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 27, 1996
Grant Date -
N/A
app pub date -
Nov 7, 1994
filing date -
Nov 7, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A resinoid dicing blade having approximately a 20% by volume porosity structure is coated and impregnated with Teflon.RTM. by a process which impregnates the resinoid blade with Teflon.RTM. to about 0.3 to 0.5% by weight. The Teflon.RTM. impregnated dicing blades not only reduces nozzle chipping when bonded silicon wafers are separated into a plurality of individual printhead die, but blade life is significantly increased.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully