Method and apparatus for inspecting solder portions
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United States of America Patent
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-
Feb 27, 1996
Issued Date -
N/A
app pub date -
Feb 24, 1994
filing date -
Apr 18, 1990
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A solder portion is inspected as follows. An image of the solder portion is obtained. The image of the solder portion is collated with a plurality of predetermined reference patterns corresponding to different solder portion types respectively. A type of the solder portion is identified in response to a result of the collation. A decision is made as to whether the solder portion is satisfactory or unsatisfactory in response to the identified type thereof.
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