Semiconductor device having ball-bonded pads
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United States of America Patent
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Mar 5, 1996
Issued Date -
N/A
app pub date -
Apr 8, 1994
filing date -
Jul 15, 1992
priority date (Note) -
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Abstract
An integrated circuit (IC) device comprises towers of bonded gold balls located on each bond pad. The towers allow for early encapsulation of the IC die. The IC can then be tested and attached to tab tape or a printed circuit board without particulate contamination concerns.
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