Cleaning wafer substrates of metal contamination while maintaining wafer smoothness
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United States of America Patent
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Mar 12, 1996
Grant Date -
N/A
app pub date -
Jun 23, 1994
filing date -
Jun 23, 1994
priority date (Note) -
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Abstract
Process for cleaning wafer substrates of metal contamination while maintaining wafer smoothness by contacting the wafer substrates with a cleaning composition comprising an aqueous, metal ion-free base and an amphoteric surfactant and optionally a metal complexing agent and a propylene glycol ether organic solvent.
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