Semiconductor device and its manufacturing method
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United States of America Patent
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Mar 12, 1996
Grant Date -
N/A
app pub date -
Aug 24, 1994
filing date -
Aug 25, 1993
priority date (Note) -
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status (Latency Note)
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Abstract
In a semiconductor device is provided a semiconductor element 22 encapsulated in a package 26. The connection area 29 used to connect an external structure, such as a heat-dissipating plate 30 or another semiconductor device, is installed in either the die pad 23 used for mounting the semiconductor element or inner leads 24 that are electrically connected to the semiconductor element. The connection area is integrated with the external structure via linking holes 28 that have been formed in the package. By combining a packaged and completed semiconductor device with various types of external structures, it becomes possible to expand or enhance the function of the overall semiconductor device, or to lower its cost.
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