Method for manufacturing printed circuit board with through-hole
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United States of America Patent
Stats
-
Mar 19, 1996
Grant Date -
N/A
app pub date -
Nov 29, 1994
filing date -
Dec 1, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed circuit board is manufactured by steps of forming on a laminate a plurality of penetrating holes, a plurality of semi-circular grooves, and a plurality of semi-circular through-holes. The plurality of penetrating holes are formed at predetermined locations along a straight line on the laminate board whose two surfaces are copper plated. The plurality of semi-circular grooves are formed from the penetrating holes which are cut into halves by a slit forming process. The plurality of semi-circular through-holes are formed using a jig member inserted into said slit and forming a copper plated layer on a surface of each of said semi-circular grooves. Highly reliable semi-circular through-holes can be formed because no peeling or burrs develop in the copper plated layer.
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