Method for manufacturing a printed circuit board having electrodes on end surface of substrate
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United States of America Patent
Stats
-
Mar 19, 1996
Grant Date -
N/A
app pub date -
Dec 19, 1994
filing date -
Dec 17, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The method for manufacturing a printed circuit board having an electrode on an end surface of a substrate has the steps of forming a hole at a predetermined position of a laminate board whose two surfaces are copper plated, filling in the hole with copper paste, forming a circuit pattern such that a copper foil portion remains only in one half of the hole, and etching an exposed region of the substrate. No mechanical process is used in the formation of the end face through-hole so that it is free from the development of burrs in or peeling off of a conductive layer.
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