Molding machine for semiconductor package
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United States of America Patent
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-
Mar 26, 1996
Grant Date -
N/A
app pub date -
Sep 1, 1994
filing date -
Sep 4, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A molding machine is provided for a semiconductor package. The machine has two transfer rods for compressing resin into a leadframe of the mold. One transfer rod will move resin into the mold when the rod is moved downward and the second transfer rod will move resin into the mold when the rod is moves upwardly. Means are provided for selectively operating the transfer rods as needed depending on the type of mold used.
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