Mold for a semiconductor package
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United States of America Patent
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-
Mar 26, 1996
Grant Date -
N/A
app pub date -
Apr 17, 1995
filing date -
Apr 22, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A mold for a semiconductor package having a port for feeding resin which can be fixed either in an upper mold (1) or a bottom mold (2) corresponding to the location of the flange tip so that the operating rate of the equipment is increased to achieve high productivity.
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