High density LED arrays with semiconductor interconnects

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United States of America Patent

PATENT NO 5501990
SERIAL NO

08415796

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Abstract

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A high density LED array with semiconductor interconnects includes a plurality of layers of material stacked on a substrate including a conductive layer, a first carrier confinement layer, an active layer, and a second carrier confinement layer. The layers are separated into isolated LEDs in a matrix of rows and columns with the conductive layer connecting a first electrode of each LED in a column to a first electrode of each other LED in the column. Row conductors connect a second electrode of each LED in a row to a second electrode of each other LED in the row and column conductors are connected to the conductive layer of each column.

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Patent Owner(s)

  • MOTOROLA, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gable, Benjamin W Chandler, AZ 8 296
Holm, Paige Phoenix, AZ 9 261

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