Method for forming metal plug and/or wiring metal layer
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United States of America Patent
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Mar 26, 1996
Issued Date -
N/A
app pub date -
Nov 21, 1994
filing date -
May 29, 1991
priority date (Note) -
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status (Latency Note)
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Abstract
A method of forming a metal plug, including a step of flattening by polishing the surface of a contact plug which is formed by etching back a metal layer, for example, a deposited layer of Blk-W on a substrate. It also makes it possible to print a wiring metal layer by a lithographic process which has thus far been considered difficult to apply to Blk-W. In the method of the invention, a contact hole 3 is opened in an insulation film layer 2 on a substrate 1, and, after coating an adhesion layer 4, a metal layer 5 is deposited on the entire surface. Thereafter, the surface of the metal layer 5 is flattened by a polishing operation, and etched back to form a metal plug 7.
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