Integrated circuit device
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United States of America Patent
Stats
-
Mar 26, 1996
Grant Date -
N/A
app pub date -
Feb 7, 1994
filing date -
Mar 4, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit device includes a first insulation layer formed on a substrate; a second insulation layer formed above the first insulation layer; a thin-film resistor formed on the second insulation layer; a third insulation layer in covering relation to the thin-film resistor and the second insulating layer; first contact holes penetrating the third insulation layer in association with the thin-film resistor; second contact holes penetrating through the second and third insulation layers; and conductive layers for electromagnetically shielding the thin-film resistor, the conductive layers including a first conductive layer formed between the first and second insulation layers below the thin-film resistor and a wiring layers formed above the thin-film resistor within the first and second contact holes.
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