Method for electrically and mechanically connecting at least two conductive layers
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United States of America Patent
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Apr 2, 1996
Issued Date -
N/A
app pub date -
Jan 8, 1993
filing date -
Jun 10, 1988
priority date (Note) -
Expired
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Abstract
A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.
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