Process for solder ball interconnecting a semiconductor device to a substrate using a noble metal foil embedded interposer substrate
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United States of America Patent
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Apr 2, 1996
Issued Date -
N/A
app pub date -
Aug 12, 1993
filing date -
Aug 28, 1989
priority date (Note) -
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Abstract
A process of interconnecting a semiconductor device to a substrate wherein solder balls on the semiconductor device are fused with one side of an embedded noble metal foil within a through hole in an interposer structure. Solder balls on the substrate are fused with the metal foil within the structure window on the other side of the metal foil.
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