Method of clean up of a patterned metal layer
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United States of America Patent
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Apr 9, 1996
Issued Date -
N/A
app pub date -
Jun 7, 1995
filing date -
Dec 16, 1992
priority date (Note) -
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status (Latency Note)
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Abstract
A method of fabricating deformable mirror devices, or any other device, in which a metal pattern is to be etched over a photoresist layer. The method includes removal of a contaminating layer (11) that occurs as a result of the metal etch. This removal is accomplished at the wafer level, with an anhydrous hydrofluoric etch followed by a wet rinse.
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