Electrical interconnect using particle enhanced joining of metal surfaces

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5506514
SERIAL NO

08422546

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when said contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces. The invention includes preferred and alternative embodiments incorporating particle enhanced material that provide a semiconductor test array which may be patterned as desired to receive an integrated circuit die and/or packaged components to facilitate integrated circuit and packaged electronic component testing; a probing device for testing integrated circuit die in situ on a semiconductor wafer; connectors for coupling discontinuous circuit element substrates; an interposer for interconnecting conventional components, circuit boards, and assemblies; and connectors for single and multiple layer circuit boards.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
NANOPIERCE TECHNOLOGIES, INC.DENVER, CO4

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Difrancesco, Louis Hayward, CA 15 679

Cited Art Landscape

Patent Info (Count) # Cites Year
 
SHARP KABUSHIKI KAISHA (1)
* 4814040 Method of connecting electronic element to base plate 79 1988
 
BOOKHAM TECHNOLOGY PLC (1)
6487087 Optical interface arrangement 5 2000
 
NANOPIERCE TECHNOLOGIES, INC. (1)
* 4804132 Method for cold bonding 135 1987
 
BBC BROWN BOVERI AG (1)
* 4606778 Joining method 20 1984
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
GENERAL ELECTRIC COMPANY (4)
7375420 Large area transducer array 21 2004
* 2006/0133,198 Large area transducer array 2 2004
7867824 Methods of fabricating a large area transducer array 0 2008
* 2008/0213,933 METHODS OF FABRICATING A LARGE AREA TRANSDUCER ARRAY 4 2008
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
6552529 Method and apparatus for interim assembly electrical testing of circuit boards 1 2001
6818822 Conductive gasket including internal contact-enhancing strip 8 2004
 
NANOPIERCE TECHNOLOGIES, INC. (2)
6630203 Electroless process for the preparation of particle enhanced electric contact surfaces 14 2001
* 2004/0087,128 Method and materials for printing particle-enhanced electrical contacts 1 2003
 
SEIKO EPSON CORPORATION (8)
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6340606 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument 21 2000
6815815 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument 3 2001
7094629 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument 2 2004
7518239 Semiconductor device with substrate having penetrating hole having a protrusion 3 2006
* 2006/0249,832 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument 3 2006
7871858 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument 0 2008
8310057 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument 0 2010
 
Exatron, Inc. (1)
* 7914296 Interconnecting assembly with conductive lever portions on a support film 6 2010
 
U.S. BANK NATIONAL ASSOCIATION (1)
* 2003/0057,260 Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 0 2002
 
MICRON TECHNOLOGY, INC. (11)
* 6028436 Method for forming coaxial silicon interconnects 26 1997
* 6045026 Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 8 1998
6296171 Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 10 1999
6175242 Method for forming coaxial silicon interconnects 14 1999
6392430 Method of forming coaxial silicon interconnects 9 2000
6427899 Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 3 2001
6419143 Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 3 2001
6469532 Apparatus for forming coaxial silicon interconnects 19 2002
6619532 Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 2 2002
6851597 Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 1 2002
6646458 Apparatus for forming coaxial silicon interconnects 7 2002
 
VISTEON GLOBAL TECHNOLOGIES, INC. (1)
* 5994648 Three-dimensional molded sockets for mechanical and electrical component attachment 19 1997
 
SAMSUNG ELECTRONICS CO., LTD. (1)
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PRESTONE PRODUCTS CORPORATION (1)
* 2005/0112,436 Methods and devices for heating or cooling fuel cell systems 1 2003
 
Johnstech International Corporation (2)
* 9297832 Electrically conductive pins for microcircuit tester 0 2014
* 2014/0266,279 Electrically Conductive Pins For Microcircuit Tester 0 2014
 
R-TEC CORPORATION (1)
* 2005/0003,171 Plated via interposer 0 2004
 
FUJITSU LIMITED (2)
6469394 Conductive interconnect structures and methods for forming conductive interconnect structures 15 2000
6543674 Multilayer interconnection and method 3 2001
 
NXP USA, INC. (2)
* 7034558 Test system for device and method thereof 0 2002
* 2004/0022,039 Reduced inductance contactor 0 2002
 
SV Probe Pte. Ltd. (1)
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AMERICAN VEHICULAR SCIENCES LLC (6)
6326704 Vehicle electrical system 36 1999
6533316 Automotive electronic safety network 89 2001
6648367 Integrated occupant protection system 81 2001
6733036 Automotive electronic safety network 74 2001
9443358 Vehicle software upgrade techniques 2 2007
9022417 Single side curtain airbag for vehicles 0 2013
 
POLAR ELECTRO OY (2)
* 8125793 Electric circuitry arrangement 0 2009
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AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. (1)
* 6605951 Interconnector and method of connecting probes to a die for functional analysis 108 2000
 
COMPONENTZEE, LLC (1)
* 9577358 Fluid pressure activated electrical contact devices and methods 0 2015
* Cited By Examiner