US Patent No: 5,506,514

Number of patents in Portfolio can not be more than 2000

Electrical interconnect using particle enhanced joining of metal surfaces

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ATTORNEY / AGENT: (SPONSORED)
 

Importance

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Abstract

A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when said contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces. The invention includes preferred and alternative embodiments incorporating particle enhanced material that provide a semiconductor test array which may be patterned as desired to receive an integrated circuit die and/or packaged components to facilitate integrated circuit and packaged electronic component testing; a probing device for testing integrated circuit die in situ on a semiconductor wafer; connectors for coupling discontinuous circuit element substrates; an interposer for interconnecting conventional components, circuit boards, and assemblies; and connectors for single and multiple layer circuit boards.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
NANOPIERCE TECHNOLOGIES, INC.DENVER, CO14

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Difrancesco, Louis Hayward, CA 15 503

Cited Art

Patent Info (Count) # Cites Year
 
BBC BROWN BOVERI AG (1)
4,606,778 Joining method 20 1984
 
BOOKHAM TECHNOLOGY PLC (1)
6,487,087 Optical interface arrangement 5 2000
 
NANOPIERCE TECHNOLOGIES, INC. (1)
4,804,132 Method for cold bonding 67 1987
 
SHARP KABUSHIKI KAISHA (1)
4,814,040 Method of connecting electronic element to base plate 78 1988

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (11)
6,028,436 Method for forming coaxial silicon interconnects 24 1997
6,045,026 Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 6 1998
6,296,171 Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 8 1999
6,175,242 Method for forming coaxial silicon interconnects 14 1999
6,392,430 Method of forming coaxial silicon interconnects 9 2000
6,427,899 Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 2 2001
6,419,143 Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 2 2001
6,469,532 Apparatus for forming coaxial silicon interconnects 19 2002
6,619,532 Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 1 2002
6,851,597 Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 0 2002
6,646,458 Apparatus for forming coaxial silicon interconnects 7 2002
 
SEIKO EPSON CORPORATION (7)
6,097,610 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument 17 1999
6,340,606 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument 19 2000
6,815,815 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument 3 2001
7,094,629 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument 2 2004
7,518,239 Semiconductor device with substrate having penetrating hole having a protrusion 3 2006
7,871,858 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument 0 2008
8,310,057 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument 0 2010
 
AMERICAN VEHICULAR SCIENCES LLC (4)
6,326,704 Vehicle electrical system 30 1999
6,533,316 Automotive electronic safety network 68 2001
6,648,367 Integrated occupant protection system 65 2001
6,733,036 Automotive electronic safety network 66 2001
 
FUJITSU LIMITED (2)
6,469,394 Conductive interconnect structures and methods for forming conductive interconnect structures 6 2000
6,543,674 Multilayer interconnection and method 3 2001
 
GENERAL ELECTRIC COMPANY (2)
7,375,420 Large area transducer array 3 2004
7,867,824 Methods of fabricating a large area transducer array 0 2008
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
6,552,529 Method and apparatus for interim assembly electrical testing of circuit boards 1 2001
6,818,822 Conductive gasket including internal contact-enhancing strip 3 2004
 
EXATRON, INC. (1)
7,914,296 Interconnecting assembly with conductive lever portions on a support film 0 2010
 
FREESCALE SEMICONDUCTOR, INC. (1)
7,034,558 Test system for device and method thereof 0 2002
 
LSI LOGIC CORPORATION (1)
6,605,951 Interconnector and method of connecting probes to a die for functional analysis 101 2000
 
NANOPIERCE TECHNOLOGIES, INC. (1)
6,630,203 Electroless process for the preparation of particle enhanced electric contact surfaces 9 2001
 
POLAR ELECTRO OY (1)
8,125,793 Electric circuitry arrangement 0 2009
 
SAMSUNG ELECTRONICS CO., LTD. (1)
6,107,792 Test board having a plurality of power supply wiring patterns 1 1998
 
SV PROBE PTE LTD. (1)
6,245,445 Rough electrical contact surface 4 1999
 
VISTEON GLOBAL TECHNOLOGIES, INC. (1)
5,994,648 Three-dimensional molded sockets for mechanical and electrical component attachment 12 1997