Tape BGA package die-up/die down
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 9, 1996
Issued Date -
N/A
app pub date -
Feb 17, 1995
filing date -
Jan 25, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A ball grid array (BGA) package which contains an integrated circuit die that is directly mounted to either a heat sink or a printed circuit board. In one embodiment, the package has an integrated circuit with surface pads that are coupled to a flexible circuit board. Solder balls are attached to the flexible circuit board and solder the BGA package to a printed circuit board. The flexible circuit has an opening that exposes the integrated circuit and allows the IC to be soldered to the printed circuit board by solder balls attached directly to the surface pads of the IC die. The direct attachment between the die and printed circuit board increases the number of IC output pins. The flexible circuit board and die are covered by a protective injection molded plastic housing. In a second embodiment, the integrated circuit die is flipped upside down and a surface of the die is exposed through the plastic housing. A heat sink can be attached to the exposed die surface to improve the thermal performance of the package.
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