Method of manufacturing a capacitance sensor
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United States of America Patent
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-
Apr 16, 1996
Grant Date -
N/A
app pub date -
Dec 5, 1994
filing date -
Dec 7, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A small and highly sensitive capacitance type pressure sensor is obtained by filling an alkali halide material such as KBr into a through-hole, forming a conductive thin film on the surface, and dissolving and removing the alkali halide material. An insulating plate disposed with a through-hole in the thickness direction is filled with a molten alkali halide material such as KBr. After forming a conductive thin film on the surface of the alkali halide material filled into the through-hole and the vicinity thereof, the alkali halide material is dissolved by water and removed. In this way, a diaphragm is made of the through-hole and the conductive thin film. A curve of the diaphragm caused by a pressure difference between the both faces of the conductive thin film is detected as a capacitance change between the conductive thin film and the electrode layer.
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