Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same
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United States of America Patent
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Apr 16, 1996
Grant Date -
N/A
app pub date -
Feb 14, 1994
filing date -
Feb 14, 1994
priority date (Note) -
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Abstract
Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump forming step includes the steps of coating a polymer material on a substrate, curing the polymer and the etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal such as gold on the polymer bump.
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