Mounting arrangement for semiconductor devices
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United States of America Patent
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-
Apr 16, 1996
Grant Date -
N/A
app pub date -
Mar 24, 1994
filing date -
Apr 1, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An arrangement for making fatigue-free external connections to a device mounted on a direct copper bonded substrate, in which one or more connector tubes are brazed to respective copper areas on the substrate before the device is mounted on the substrate, and external connections are made by soldering leads or bus bars into the tubes.
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