High density, high speed, semiconductor interconnect using-multilayer flexible substrate with unsupported central portion
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United States of America Patent
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Apr 16, 1996
Grant Date -
N/A
app pub date -
Oct 28, 1993
filing date -
Oct 28, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An interconnect structure formed of a flexible, multilayer dielectric material such as polyimide, having a support ring, connection points on the section inside the support ring for connecting one or more semiconductor chips, and connection points outside the support ring for connecting to a circuit board. Alignment templates are disclosed which align the semiconductor chip with the connection points.
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