Apparatus for forming a double-bump structure used for flip-chip mounting
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United States of America Patent
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Apr 16, 1996
Grant Date -
N/A
app pub date -
Nov 14, 1994
filing date -
Nov 15, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A bump structure has a bump constituted by a metal projection which is formed on an electrode of a substrate, and a solder which covers the metal projection but does not touch the electrode. The metal projection is substantially spherical and has a projected portion at a center portion on an upper surface thereof. The metal projection is made of a metal having properties of solder diffusion prevention and adhesion to solder. The bump structure may have two bumps, the first bump being substantially the same as the bump described above and the second being such that its diameter is smaller than an outer diameter of the first bump and it covers the projected portion on the first bump. This bump structure can be formed using a simple process, and can be applied to flip-chip mounting in semiconductor devices with high reliability and yield.
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