Semiconductor device having a plurality of chips having identical circuit arrangement sealed in package
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United States of America Patent
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Apr 16, 1996
Issued Date -
N/A
app pub date -
Dec 14, 1994
filing date -
Dec 18, 1992
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device includes a first chip having a circuit arrangement, and a plurality of first terminals formed on a main surface of the first chip and substantially arranged into a line. The semiconductor device also includes a second chip having a circuit arrangement identical to that of the first chip, and a plurality of second terminals formed on a main surface of the second chip and substantially arranged into a line. The first and second chips are arranged in a predetermined direction perpendicular to the main surfaces of the first and second chips. The semiconductor device also includes a plurality of connecting members connected to the first terminals and the second terminals and provided for external connections.
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