Polytetrafluoroethylene porous film

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United States of America Patent

PATENT NO 5510176
SERIAL NO

08295070

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Abstract

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The polytetrafluoroethylene (PTFE) porous film of the invention is characterized in that the film is formed from a PTFE resin molding powder obtained by suspension polymerization and has a porosity of 40 to 80%, and removal ratio of uniform particle having a 0.2 .mu.m diameter of less than 99% or bubble point of not less than 3 kg/cm.sup.2. This PTFE porous film is obtained by a process of compression-molding a PTFE resin molding powder to prepare a preform, sintering the preform at a temperature not lower than its melting point, processing the preform into films, then laminating at least two of the obtained films, fusing the films to unite them, and subjecting the obtained film to uniaxial or biaxial stretching at a temperature not higher than the melting point of PTFE. If desired, the finally obtained film may be subjected to heat setting. In the PTFE porous film of the invention, pores are nearly round and the diameters of the pores are almost uniform. Further, the porous film of the invention has a high porosity and is excellent in mechanical strength, so that the film is free from the occurrence of pinholes even when the thickness of the film is made small. According to the processes of the invention for preparing a PTFE porous film, a PTFE porous film having the above-mentioned excellent characteristics can be efficiently prepared by a sequential biaxial stretching or the like, and the obtained PTFE film does not suffer any breakage.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI CHEMICAL CORPORATIONTOKYO 1008251

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nakamura, Atsushi Fukuoka, JP 688 7556
Nakashima, Satoshi Tokyo, JP 88 679

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