Importance

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Abstract

A method of patterning a multilayer, dielectric color filter is described. The method includes depositing a multilayer, dielectric color filter on a substrate having top, bottom and multiple intermediate layers; and applying a patternable mask onto the top layer to provide selected openings through the mask. The method further includes removing the top layer through the selected openings in the patterned mask using a first dry etch, the patterned mask and the multiple intermediate layers of the filter being resistant to this first dry etch, to provide openings to the multiple intermediate layers of the filter. It is a feature of the invention to remove the patterned mask using a second dry etch, the top layer and multiple intermediate layers of the filter being resistant to this second dry etch; and to remove through the openings in the top layer the multiple intermediate layers of the filter, down to the bottom layer, using a third dry etch, the top layer and bottom layer being resistant to this third dry etch.

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First Claim