Multilayer microstrip wiring board with a semiconductor device mounted thereon via bumps
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United States of America Patent
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Apr 23, 1996
Grant Date -
N/A
app pub date -
Apr 6, 1994
filing date -
Apr 7, 1993
priority date (Note) -
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Abstract
A semiconductor device includes a microstrip wiring board. The microstrip wiring board includes a substrate having a main surface, a ground conductor extending on the main surface of the substrate, a dielectric film extending on the ground conductor, and a metal wiring line extending on the dielectric film. A semiconductor chip is connected to the microstrip wiring board via a bump.
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