Importance

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Abstract

A high functional capacity semiconductor based system for which the semiconductor material cost increases substantially linearly with functional capacity. The device is manufactured by taking individual, lower functional capacity devices having an extendible architecture and utilizing them in a high interconnect packaging method such as flip-chip technology. Multiple individual chips are interconnected into a single, larger device by means of this packaging technique. Because each individual chip is extendible, the resulting larger capacity device has substantially the same architecture as the smaller devices from which it is made. This means that the final device is essentially equivalent to a higher capacity single device based on the architecture of the smaller component devices. In a preferred embodiment of the invention, the result is a high capacity programmable gate array having a semiconductor cost which increases substantially linearly with the number of gates, and which uses a straightforward extension of the development tools used for application designs based on the individual chips.

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First Claim