Inorganic chip-to-package interconnection circuit
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United States of America Patent
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Apr 30, 1996
Grant Date -
N/A
app pub date -
Sep 9, 1994
filing date -
Sep 9, 1994
priority date (Note) -
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Abstract
An inorganic chip-to-package interconnection circuit is described. The circuit has a set of electrical conductors that are held together by a set of insulating inorganic tie bars. The circuit constitutes a high-density chip-to-package interconnection circuit that does not absorb vapor or volatile gases. A variety of methods for forming the circuit are described. Advantageously, the methods utilize known processing techniques.
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