Clamp with wafer release for semiconductor wafer processing equipment

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5513594
SERIAL NO

08140351

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An apparatus for releasably clamping a substrate to a support platform, or other support system, at a face of the substrate is described. In one embodiment, a retractable clamp holds a substrate near its edges on a support platform when the clamp is in its fully extended position. One or more leaf springs are mounted to the clamp and apply force to the substrate at respective points in the event the substrate adheres to the clamp, thereby releasing the substrate from the clamp. In a preferred embodiment of the present invention, one or more activators are positioned in cooperative relationship to the leaf springs to cause the leaf springs to retract into recesses in the clamp when the clamp is extended against the substrate. In their retracted position, the leaf springs do not contact the substrate so as to minimize the generation of particle contamination and the chance of the release leaf springs themselves adhering to the substrate.

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Patent Owner(s)

Patent OwnerAddress
NOVELLUS SYSTEMS INC4650 CUSHING PARKWAY FREMONT CA 94538

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Anderson, Kenneth E 1958 Janet Ave., San Jose, CA 95124 49 904
Hutchinson, Martin A 3846 Shasta Dr., Santa Clara, CA 95051-5848 16 619
McClanahan, Adolphus E 870 S. Saratoga Ave. #F-110, San Jose, CA 95129 8 113
Nicholson, Phillip B 4577 Doyle Rd., San Jose, CA 95129 2 71
Turner, Frederick T 1478 Bittern Dr., Sunnyvale, CA 94087 12 340

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