Apparatus for burn-in of high power semiconductor devices
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United States of America Patent
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May 14, 1996
Grant Date -
N/A
app pub date -
May 3, 1993
filing date -
May 3, 1993
priority date (Note) -
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Abstract
A thermal control system for use with a burn-in system, the thermal control system capable of delivering a thermally preconditioned liquid to a plurality of semiconductor devices during burn-in. The thermal control system comprises a liquid reservoir containing a liquid, a pump, and a plurality of spray nozzle arrays. The liquid contained in the liquid reservoir is thermally preconditioned through the use of a heating element and a cooling element and the temperature of the liquid provided to each spray nozzle array is individually controlled through the use of a pipe heating element. The liquid is collected and returned to the liquid reservoir after being sprayed on the semiconductor devices.
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