Method for encapsulating light emitting diodes
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United States of America Patent
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May 14, 1996
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app pub date -
Jan 20, 1995
filing date -
Apr 19, 1993
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Abstract
A method of encapsulating semiconductor light emitting diodes, in particular laser diodes, characterized in that a gap is formed in an encapsulant, which is positioned in front of the light emitting facet of the diode, the gap preventing the encapsulant from adhering to the light emitting facet.
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