Structure of the flexing section of a multilayer flexible circuit board
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United States of America Patent
Stats
-
May 14, 1996
Grant Date -
N/A
app pub date -
Feb 10, 1995
filing date -
May 16, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A structure of the flexing section of a multilayer flexible circuit board wherein at least one layer of a flexible insulation base material is bonded, via an adhesive agent layer, between a plurality of wiring conductors on which required wiring patterns are formed with conductive foil, the flexible insulation base material of the flexing section of the multilayer flexible circuit board being provided with a non-bonded portion so that it is not bonded with the wiring conductors or another flexible insulation base material at least on one surface.
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