Semiconductor package and method with vertically extended electrode leads
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 14, 1996
Issued Date -
N/A
app pub date -
Jun 7, 1995
filing date -
Feb 25, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
A package for one or more semiconductor devices has an electrically insulative and thermally conductive base on a thermally conductive support. The semiconductor devices may be enclosed in an encapsulant and are electrically contacted through leads that extend through the encapsulant.
Loading the Abstract Image...
OK
First Claim
Family
Loading Family data...
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully