Procedure and apparatus for improving a plasma accelerator plating apparatus used for diamond plating
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United States of America Patent
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May 21, 1996
Grant Date -
N/A
app pub date -
Nov 9, 1994
filing date -
Jan 10, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A plating apparatus used in a diamond plating process in which a first electrode having a surface from which plating material is released is located in connection with a firing electrode to generate a first arc, the first arc being used to start a second arc between the first electrode and a second electrode, and in which apparatus a plasma spray formed from plating material released from the first electrode is directed toward a substrate to be plated includes a grinding element in contact with the surface of the first electrode and a mechanism for rotating the surface of the first electrode. The grinding element may be a firing electrode or an abrading tool. A method of operating the plating apparatus includes abrading the surface of the first electrode from which plating material is released.
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