Laser cutting apparatus
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United States of America Patent
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May 28, 1996
Issued Date -
N/A
app pub date -
Sep 23, 1993
filing date -
Sep 23, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus for cutting a material having a thickness, T, defined by the distance between a first surface and a second surface of the material. The apparatus comprises an energy source for providing a beam of energy, and directing mirrors for directing the beam of energy from the energy source to a first focal point between the first and second surfaces of the material, and to a second focal point between the first and second surfaces of the material. The first and second focal points are spaced apart from each other by a distance sufficient to cut through the entire thickness of the material.
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