Semiconductor device with a foil-sealed lid
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United States of America Patent
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May 28, 1996
Issued Date -
N/A
app pub date -
Aug 17, 1993
filing date -
Jan 27, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device includes a semiconductor substrate forming the bottom portion of a package of the device and a ceramic plate forming the upper or lid portion of the device. The substrate includes a layer of metal on its upper surface along the substrate outer edge and spaced apart from electrodes on the substrate upper surface. The ceramic plate includes a copper foil on its lower surface along the outer edge thereof which overlaps and is bonded to the substrate metal layer. The ceramic plate has apertures therethrough which are sealed by copper foils on the inside of the package, the foils being bonded to respective ones of the substrate electrodes.
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